manufacturer :       X-Tek

model :                   BT 160

annotation :           Dokumente engl.

BENCHTOP MICROFOCUS X-RAY

Real-time microfocal radiography is recognised as one of the most advanced non-destructive inspection techniques available. Hidden or buried features, such as voiding, porosity, IC die and wire Bonding, internal seals, solder joints, etc. can be analysed inside all metal, plastic and ceramic packaging.

The "Benchtop" has a fully shielded and interlocked enclosure, which is safe for continuous use by unbadged personnel and is simple to operate.

The item to be inspected is placed in the sample manipulator, between x-ray source and detector, the door closed and x-rays switched on. X-rays penetrating the sample strike the front scintillator plate of an x-ray sensitive image intensifier, whose visible light output is collected by a high resolution CCD video camera. The sample can be seen through the large viewing window and manoeuvred freely in 5 axes, as the live x-ray image is studied on the monitor. X, Y, Z, rotation and tilt are provided by the manipulator, which is controlled via proportional joysticks to facilitate optimum positioning of the sample.

The x-ray image can be further enhanced by adding a choice of video image processing systems, offering functions including pseudo 3D, edge and colour enhancement, micrometry, wire sweep and % void calculations.

With x-ray energies up to 160kV, electronic components, hybrids, and assemblies, as well as small mechanical components can bt inspected with ease. The unique "Ultrafocus" target, with its micron focal spot just 6mm behind the output window, produce5 sharp images of IC bond wires at 100 times magnification.

Installation requires just a single 240V mains connection. The vacuum systems and cooling circuits are entirely seif contained.

Naturally, Full Operator training and lifetime Backup are provided The x-ray source is customer serviceable, and target and filameni changes are quick and easy, resulting in minimal cost of ownership.

SPECIFICATION

X-ray source:

X-Tek "open type" de-mountable tube.

Operating voltage options: 30 to 100kV, 125kV or 160kV.

Beam current: 1mA max.

X-ray power options 60 watts, 100 watts, 200 watts.

Focal spot size options: 5 micron, 10 micron.

Target: Indexable tungsten.

Target cooling: Closed circuit recirculating water or air.

Vacuum system: Turbo-molecular with 2 stage rotary vane backing.

X-Ray control: kV, mA, Auto-focus, Auto-Power limit.

Imaging system:

150mm (100mm optional) x-ray image intensifier coupled to high resolution CCD camera.

High quality 14" black and white monitor.

Image processing options to suit application.

Sample manipulator:

Remote joy stick controlled precision 5 axis.

Variable Speed and overload protection on all axes.

Load capacity 2Kg.

Travel: X axis 200mm

Y axis 200mm

Z axis 500nun

Rotate 360 deg.

Tilt+/- 30 deg.

Cabinet

Lead shielded enclosure, hinged shielded and interlocked access door with viewing window.

Waming lights and safety interlock control circuits including key Lockout switch.

Dimension:    Height - 900mm

                      Length - 1040mm + 450mm imaging extension.

                      Depth - 660mm

The enclosure meets all international safety standards.

The system can be customised to suit specific application, full details from X-Tek.

Due to constant improvement and development the above specification is subject to change.